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May 7, 2008 |
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IN THIS EDITION |
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NEWS |
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EDITOR'S PICKS |
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PRODUCTS |
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UPCOMING EVENTS |
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Dear Subscriber,
Is becoming "vertically integrated" the latest trend? If you consider leading foundry TSMC's recent announcements about expanding beyond design and manufacturing to offer testing and packaging (focusing on wafer-level packaging), it certainly looks that way. As Gartner's Jim Walker points out, it's a move worth watching because it's a potential loss of business for contract IC assembly and test houses to the foundry. Companies moving up or down the "food chain," searching for value-add, is something we're likely to continue seeing. Read Phil Garrou's take on TSMC's plans (highlighted in Editor's Picks below), and keep up with the latest developments at our Packaging Technology Channel:
www.semiconductor.net/packaging
Sally Cole Johnson, Contributing Editor
scolejohnson@mac.com |
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Aviza Announces Fiscal Year 2008 2Q Results
Business Wire, 5/6/2008
Aviza Technology Inc. reported results for the second quarter of fiscal year 2008, which ended on March 28, 2008. Shipments for the second quarter totaled $28.3M. Net sales for the quarter of $30.2M were in line with the company's guidance of $30-$35M. Second quarter net loss was $30.1M, or $1.38 per share. Adjusted net loss was $6.3M, or $0.29 per share. More |
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President of Amkor Technology Named
Business Wire, 5/5/2008
Amkor Technology announced that Ken Joyce has been appointed president of the company. Joyce will also continue as COO and report to James Kim, Chairman and CEO. More |
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Amkor Reports First Quarter 2008 Results
Business Wire, 4/30/2008
Amkor Technology reported its financial results for the first quarter, ended March 31, 2008. First quarter net sales of $699M were down sequentially 6.3% from the fourth quarter of 2007 and up 7.4% from the first quarter of 2007. More |
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Siliconware Q1 Revenues Decline 15.8%
PR Newswire, 4/30/2008
Siliconware Precision Industries Co. Ltd.'s (SPIL) sales revenues for 1Q08 was ~NT$15 million, representing 15.8% sequential decline QoQ and 8.6% growth compared with 2007. SPIL reported a net income of ~NT$1.8 million in 1Q08, compared with a net income of ~NT$5 million in 4Q07 and a net income of ~NT$4 million in 1Q07. More |
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FormFactor Reports Q1 Revenues of $65.7M, Down 36% YoY
Market Wire, 4/29/2008
FormFactor Inc. announced its financial results for the first quarter of fiscal 2008, ended March 29, 2008. Quarterly revenues were $65.7M, down 45.5% from $120.5M in the fourth quarter of fiscal 2007, and down 35.8% from $102.3M in the first quarter of fiscal 2007. More |
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Tessera Licenses Shellcase MVP Technology to Nemotek
Business Wire, 4/29/2008
Tessera Technologies Inc. and Nemotek SA recently announced that Nemotek has licensed the Shellcase MVP wafer-level chip-scale packaging (WLCSP) solution from Tessera. The Shellcase MVP solution, which Tessera announced on March 18, 2008, will enable Nemotek to provide OEMs and camera module manufacturers with the ability to build smaller, thinner and more sophisticated consumer devices, such as camera phones, digital cameras, PDAs and laptops. More |
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Oki Integrates AlGaAs LEDs on Silicon Mounting Chips
Kenji Tsuda, Asia Contributing Editor — Semiconductor International, 4/24/2008
Oki Digital Imaging Corp. (Tokyo) is in mass production with LED print heads that mount ~5000 AlGaAs light-emitting diodes (LEDs) on CMOS driver ICs. The print heads are being mass produced at a rate of 100,000-200,000 units monthly with high reliability, Oki engineers said at the Fourth International Nanotechnology Conference on Communication and Cooperation (INC4), held last month in Tokyo. More |
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STATS ChipPAC Reports First Quarter 2008 Results
Market Wire, 4/23/2008
STATS ChipPAC Ltd. announced results for the first quarter 2008. Tan Lay Koon, president, said, "Revenue for the first quarter of 2008 of $427.2M increased by 9.4% over the first quarter of 2007 and declined by 10.4% from prior quarter." More |
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STMicro Kicks Off Greater China HQ R&D Center
Yao Gang, Editor-in-Chief, SI China — Semiconductor International, 4/17/2008
STMicroelectronics Corp. (Geneva) inaugurated a $25M R&D center at its Greater China headquarters in the Shanghai Zizhu Science-Based Industrial Park earlier last month. COO Alain Dutheil also said the second STMicro assembly and test plant in Longgang, China, with a $500M investment, is expected to go into operation this year. More |
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Perspectives From the Leading Edge: TSMC Makes Its Play for a Bigger Portion of the Pie
Philip Garrou — Semiconductor International, 5/2/2008
According to TSMC's new roadmap, revealed at its recent "open innovation platform" meeting, the foundry is putting more resources into two areas: stacked-die packages and 3-D integration. This announcement should be of concern to the contract assembly and test houses (Amkor, ASE, SPIL, STATS ChipPAC, etc.). Blog |
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3-D Interconnections On the Rise
Joe Fjelstad, Founder, SiliconPipe, San Jose — Semiconductor International, 5/1/2008
The chip has been unchallenged as the ultimate form of electronic circuit integration since the invention of the IC. The rate of increased integration has steadily marched ahead since that time, keeping pace with the predictions of Moore's Law. Current projections are that Moore's prediction will hold for another several years, but it is also generally agreed that the laws of physics will eventually be applying the brakes to the progression as it was originally described. Given this reality, electronic circuit technologies and design concepts are entering a new phase of development, where the interconnect is being elevated in both significance and value. More |
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Package-on-Package Variations On the Horizon
Flynn Carson, STATS ChipPAC Inc., Fremont, Calif. — Semiconductor International, 5/1/2008
When Apple's iPhone debuted in 2007 and teardowns were immediately featured and available seemingly overnight, package-on-package (PoP) technology was prominently on display for all to see. PoP had finally made it to the limelight. However, PoP has been building steam for quite some time, and is now the package of choice to combine mobile phone processors with memory for more advanced mobile phones. More |
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| Online Buyer’s Guide: Your Search Starts and Ends Here |
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Search Semiconductor International’s Online Buyer’s Guide for products, services and vendors, or browse through product categories. It's the comprehensive buyers guide for the global semiconductor manufacturing industry. To see the latest company listings and product information, visit:
buyersguide.semiconductor.net
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Next-Gen Wire Bonders
IConn and ConnX are next-generation wire bonders. Both versions have an 80 mm bondable area, an advanced motion control system, dual frequency transducer, and a programmable power supply system.
Kulicke & Soffa Industries Inc., Fort Washington, Pa.
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Die Sorting Technology
DS 15000 is a die sorter for 300 mm wafer-level packaging and other applications. It is designed for high-speed sorting of dice from wafer into carrier, surf or punched tapes. It has a flip-chip capability of up to 15,000 UPH, and endues dual indexing for 24 hours in a continuous run.
Mühlbauer Technology Group, Roding, Germany
More |
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May 12, 2008: 3-D Integration and Packaging
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May 20-21, 2008: MEMS Packaging Course
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May 22, 2008: 6th Annual MEMS Symposium
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May 27-30, 2008: ECTC 2008
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