SI CHINA     SI JAPAN
Login  |  Register          Free Newsletter Subscription
Subscribe

RSS   Inspection, Measurement & Test

The latest news and information on semiconductor inspection, measurement and test, including metrology, microscopy, spectroscopy, spectrometry, CD measurement, defect detection/inspection, overlay and wafer inspection.

  • Reducing Test Costs, Throughputs
    Alexander Braun, Senior Editor - 07/16/2008
     At yesterday’s Test, Assembly & Packaging TechXPOT’s “Yield Management” session, various presenters demonstrated the necessity of reducing rocketing test costs. Overall, the presenters concentrated on the fact that testing becomes more difficult and costly as chip complexity continues to grow and device average selling prices (ASPs) shrink. More

  • Surface Profiler Tackles Solar Market
    Aaron Hand, Executive Editor, Electronic Media - 07/16/2008
     KLA-Tencor’s (Milpitas, Calif.) latest stylus surface profiling system, unveiled this week at Intersolar North America, offers advanced features for scientific research and production environments, such as solar cell manufacturing. More
  • Breaking the Barriers to RF Multi-DUT Tests
    Karl Stuber, Senior Director, Test, Assembly & Packaging, SEMI, San Jose - 07/11/2008
     Because test companies have reduced test time to the bare minimum, and many chipmakers have reduced capital expenditures in favor of intelligent use of equipment and approaches, the last dimension to be addressed is multi-DUT testing. More
  • Reduced CapEx for Test
    Dan Tracy, Senior Director, and Lara Chamness, Senior Market Analyst, Industry Research and Statistics Group, SEMI, San Jose - 07/11/2008
     As a percentage of total spending on semiconductor capital equipment, spending on test equipment has trended below 20% of total equipment spending since the 2000 peak year of semiconductor industry equipment spending. More
  • Planes, Test and Capacity Management
    SEMI, San Jose - 07/11/2008
     Dan Hamling, founder and CEO of Chip Nexus (San Diego), will present on Thursday, July 17, at 11:00 a.m., as part of the SEMICON West Test, Assembly and Packaging TechXPOT. He emphasizes that improved profitability and ROI will be the result of appropriate use of test capacity management. More
  • Distributed and Adaptive Test
    Karl Stuber, Senior Director, Test, Assembly & Packaging, SEMI, San Jose - 07/11/2008
     On Tuesday, July 15, at SEMICON West, there will be a TechXPOT session focused on yield management. More
  • Entangled Images Point to Better Quantum Data, Optical Measurements
    Alexander E. Braun, Senior Editor - 06/16/2008
     Convenient, versatile technique could provide new tool for quantum information processing, better optical measurements. More
  • ATE Industry Maneuvers Around ‘Perfect Storm’ of Issues at 90 nm and Below
    Sally Cole Johnson, Contributing Editor - 06/12/2008
     The combination of discrete challenges, design sensitivity and integration issues are creating complex challenges for ATE vendors. More
  • Next »

News from the Web

Advertisement


SPONSORED LINKS

News from Lexis Nexis


  • Blogs
  • Talkback
  • Podcast
  • Video

Alexander E. Braun
The Measure of All Things
Alexander E. Braun, Senior Editor, Semiconductor International
July 14, 2008
Standalone Pushes Optical CD Boundaries
Semiconductor manufacturers face tough process and business challenges. On one hand t...
More

Alexander E. Braun
The Measure of All Things
Alexander E. Braun, Senior Editor, Semiconductor International
July 6, 2008
SEM Enables Rapid Subnanometer 3-D Surface Imaging
As critical dimensions shrink and new materials are introduced, traditional SEMs are ...
More

Alexander E. Braun
The Measure of All Things
Alexander E. Braun, Senior Editor, Semiconductor International
May 19, 2008
System Gives Accurate Flicker-Noise Measurement
It’s a well-established fact in our industry that the development costs for eac...
More

Alexander E. Braun
The Measure of All Things
Alexander E. Braun, Senior Editor, Semiconductor International
May 13, 2008
A Modest Proposal
For decades now, there has been a desperate wringing of hands and loud, roaring noise...
More

» VIEW ALL BLOGS RSS
Vivek Bakshi, EUV Litho Inc.
Advocating More Open Communication on EUV Lithography

Vivek Bakshi, founder and president of EUV Litho Inc., explains why he started up the International Workshop on EUV Lithography, which took place in Maui in June. He also expands on recent developments in EUV, and why more research is needed.

Hear It Now

» VIEW ALL PODCASTS Subscribe Now to SI On the Scene and never miss an episode
CMOS and Beyond: Surface Prep at Nanoscales
Now Playing: CMOS and Beyond: Surface Prep at Nanoscales
At SEMICON West 2006, Alex Braun interviews Ahmed Busnaina, director of the NSF Nanoscale Science and Engineering Center for High-Rate Nanomanufacturing at Northeastern University. Busnaina gives his perspective on the longevity of CMOS, nanotechnology, and surface preparation at nanoscales.
Video Table of Contents  More Videos >>



NEWSLETTERS

Plug in and get the latest SI news, trends and industry updates delivered directly to your inbox!

SI NewsBreak and Special Reports (Weekdays)
Metrology Report (Monthly)


Technical Articles

    Yield Goals for 22 nm
Dilip Patel, Kye-Weon Kim, Doron Arazi, John Allgair, Benjamin Bunday, Milton Godwin, Victor Vartanian, Pete Lipscomb and Aaron Cordes, International Sematech Manufacturing Initiative (ISMI), Austin, Texas, 06/01/2008
 The industry is on target to deliver necessary defect metrology and film metrology solutions, but new overlay target structures are needed for 22 nm monitoring....

    Assessing Component Damage, Failure Risk
Ray Thomas, Sonoscan, Elk Grove Village, Ill., www.sonoscan.com; Paul Melville NXP Semiconductor, Eindhoven, Netherlands, www.nxp.com, 06/01/2008
 Acoustic imaging, combined with electrical testing, provides insight into the cause of electrical failure in plastic packages....

    CD Metrology Confidently Looks Beyond 32 nm
Alexander E. Braun, Senior Editor, 06/01/2008
 Although traditional tools are showing signs of reaching their limits, workarounds and more complex models, added to new technologies, should continue providing the needed accuracy and precision to control processes and perform inspection, measurement and test....

More View all stories


EVENTS

SEMICON Taiwan
Sept. 9-11, 2008
Taipei World Trade Center
SEMICON Europa
Oct. 7-9, 2008
Stuttgart Trade Fair Centre, Germany
ISMI Symposium on Manufacturing Effectiveness
Oct. 20-23, 2008
Austin, Texas

» VIEW ALL
Advertisements

©2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy
Please visit these other Reed Business sites