New products for semiconductor manufacturing, including semiconductor capital equipment, materials, and equipment components and subsystems.
Release Film Boosts IC Molding Productivity Kenji Tsuda, Asia Contributing Editor - 07/23/2008
Asahi Glass has developed a release film for molding thin ball grid arrays (BGAs) or chip-scale packages (CSPs). The company said the film reduces resin usage, and nearly eliminates the frequent mold cleanings required with conventional molding technologies. More
Wafer Singulation System 07/01/2008 IX-4000 is a series of high-throughput, high-speed Class 1 laser workstations, consisting of two systems: IX-4100 ChromaDice and IX-4600 ChromAblate. The 4100 model was designed for wafer singulation applications, and the 4600 version is for LED production, selective wafer annealing, micro-drilling, thin-film patterning and 3-D micro-machining.More
Liquid Contamination Filters 07/01/2008 The Torrento family of high-flow liquid filters help improve liquid contamination control of nanoscale particles in wet etch and clean manufacturing processes. 20 nm filters use a specialized non-dewetting Teflon membrane technology that attracts the contaminating particles rather than just sieving them.
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Turbomolecular Vacuum Pump 07/01/2008 The iXA is a series of magnetic bearing turbomolecular vacuum pumps. They pump exhaust process gases from PVD, etching, CVD, etc., and feature power supply and control modules that can be mounted in various configurations directly on the pumps or remotely. This eliminates cables and accessory racks while still preserving the flexibility to fit a wide range of equipment.More
Photoresist Remover 07/01/2008 EKC162 is a WLP photoresist remover that dissolves photoresist without attacking polyimide or metal layers. It has been formulated to enhance the removal of resists cleanly and efficiently with full dissolution. This prevents redeposition while minimizing damage to metal conductors, bumps and redistributed layer dielectrics.More
Xenon Difluoride Etcher 07/01/2008 The chemical vapor etch (CVE) module for xenon difluoride gas (XeF2) encapsulates a wafer in a symmetrical chamber while it is being etched. The module features edge lift to protect double-sided wafers and a cooled chuck with optional backside helium for improved etch rates, uniformity and selectivity.
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SiC Sputtering Targets 07/01/2008 High-purity silicon carbide (SiC) sputtering targets were developed to enable the deposition of high-purity SiC thin films. They are manufactured by a CVD process that results in a homogeneous and monolithic SiC target material. The targets contain no particles to spit and are ultrapure. They also ensure the absence of etch residue from reactive ion etch processes that can be used to patt...More
DFT Module 07/01/2008 Odyssey is a manufacturing yield management solution that enables inline and product engineers at fabs and fabless sites to achieve higher yield and faster ramps. An intuitive and interactive GUI provides easy selection and filtering of data, and built-in automation alert users of excursions and other yield-limiting events.
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The Measure of All Things Alexander E. Braun, Senior Editor, Semiconductor International May 13, 2008 A Modest Proposal
For decades now, there has been a desperate wringing of hands and loud, roaring noise... More
Vivek Bakshi, founder and president of EUV Litho Inc., explains why he started up the International Workshop on EUV Lithography, which took place in Maui in June. He also expands on recent developments in EUV, and why more research is needed.
Now Playing: CMOS and Beyond: Surface Prep at Nanoscales At SEMICON West 2006, Alex Braun interviews Ahmed Busnaina, director of the NSF Nanoscale Science and Engineering Center for High-Rate Nanomanufacturing at Northeastern University. Busnaina gives his perspective on the longevity of CMOS, nanotechnology, and surface preparation at nanoscales. More Videos >>
Technical Articles
Wafer Singulation System 07/01/2008 IX-4000 is a series of high-throughput, high-speed Class 1 laser workstations, consisting of two systems: IX-4100 ChromaDice and IX-4600 ChromAblate. The 4100 model was designed for wafer singulation applications, and the 4600 version is for LED production, selective wafer annealing, micro-drilling, thin-film patterning and 3-D micro-machining....
Liquid Contamination Filters 07/01/2008 The Torrento family of high-flow liquid filters help improve liquid contamination control of nanoscale particles in wet etch and clean manufacturing processes. 20 nm filters use a specialized non-dewetting Teflon membrane technology that attracts the contaminating particles rather than just sieving them....
Turbomolecular Vacuum Pump 07/01/2008 The iXA is a series of magnetic bearing turbomolecular vacuum pumps. They pump exhaust process gases from PVD, etching, CVD, etc., and feature power supply and control modules that can be mounted in various configurations directly on the pumps or remotely. This eliminates cables and accessory racks while still preserving the flexibility to fit a wide range of equipment....
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Wafer Singulation System
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