The latest news and information on MEMS manufacturing, including microelectromechanical systems, RF-MEMS and MOEMS.
Yole Updates 2007 MEMS Ranking Staff - 07/02/2008
Yole Dévelopement updated its 2007 ranking of the 30 largest MEMS suppliers, adding Sanyo Electric to the list. With 2007 sales of $5.6B, the 30 largest companies account for an estimated 80% of the global MEMS market. More
Leveraging Novel MEMS Technologies for Next-Generation Photovoltaic Applications Paul Lindner, Executive Technology Director, EV Group, St. Florian/Inn, Austria, www.evgroup.com - 07/01/2008
Cross-industry innovation involves creative imitation in the course of a radical innovation process. This article discusses a successful application of technology from the MEMS industry to the photovoltaics industry.
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WLP Could Transform MOEMS, MEMS Herwig Kirchberger, EV Group, St. Florian, Austria - 04/01/2008
True wafer-level packaging could dramatically reduce the cost of M(O)EMS manufacturing. MOEMS packages require optical transparency at the operating wavelength of the individual sensors and actuators, in addition to the conventional packaging requirements of MEMS.
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Strong Sensor, Actuator Market Driven By MEMS Technologies David Lammers, News Editor - 03/27/2008
MEMS technology is driving new applications, making sensors and actuators the fastest growing part of the overall semiconductor industry, according to IC Insights Inc. Overall growth of the chip industry is expected to be healthy over the next five years, with an 12% CAGR driven by improving ASPs.
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Yole Ranks Top 30 MEMS Suppliers; Sees Rapid Growth in Consumer, Medical Staff - 01/31/2008
Yole Développement, (Lyon, France), a market research firm specializing in MEMS, packaging and related markets, released its 2007 ranking of the top 30 MEMS manufacturers. The market research firm also broke out the fastest-growing MEMS applications, with consumer and medical fluidics markets showing particularly fast growth.
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Semiconductor International's Top 100 for 2007 Staff - 01/22/2008
Here are Semiconductor International’s very best of 2007 — the features, news, blogs and webcasts most viewed throughout the year. Key topics for the year were, and continue to be, 32 nm development, high-k/metal gates, nanotechnology, solar cells and 3-D integration, among others. If you happened to miss any, they’re all just a click away.
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Applied Microstructures Appoints Aitchison as CEO Staff - 01/15/2008
Applied Microstructures Inc. (San Jose), which sells molecular vapor deposition (MVD) equipment to customers in the MEMS, biomedical and other fields, has appointed Kenneth Aitchison as CEO.
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Explosives on a Chip: Copper Used as Fuze Staff - 12/27/2007
Tiny copper structures with pores at both the nanometer and micron size scales could play a key role in the next generation of detonators used to improve the reliability, reduce the size and lower the cost of certain military munitions.
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Vivek Bakshi, founder and president of EUV Litho Inc., explains why he started up the International Workshop on EUV Lithography, which took place in Maui in June. He also expands on recent developments in EUV, and why more research is needed.
Now Playing: CMOS and Beyond: Surface Prep at Nanoscales At SEMICON West 2006, Alex Braun interviews Ahmed Busnaina, director of the NSF Nanoscale Science and Engineering Center for High-Rate Nanomanufacturing at Northeastern University. Busnaina gives his perspective on the longevity of CMOS, nanotechnology, and surface preparation at nanoscales. More Videos >>
Technical Articles
Leveraging Novel MEMS Technologies for Next-Generation Photovoltaic Applications Paul Lindner, Executive Technology Director, EV Group, St. Florian/Inn, Austria, www.evgroup.com, 07/01/2008
Cross-industry innovation involves creative imitation in the course of a radical innovation process. This article discusses a successful application of technology from the MEMS industry to the photovoltaics industry....
WLP Could Transform MOEMS, MEMS Herwig Kirchberger, EV Group, St. Florian, Austria, 04/01/2008
True wafer-level packaging could dramatically reduce the cost of M(O)EMS manufacturing. MOEMS packages require optical transparency at the operating wavelength of the individual sensors and actuators, in addition to the conventional packaging requirements of MEMS....
Additions to the MEMS Toolkit Paula Doe, SEMI, San Jose, 06/15/2007
Developments in nanoscale processing provide some new options for the MEMS sector to consider, including diamond on insulator (DOI) wafers ready for sacrificial etching of structures with the hardness and thermal conductivity of diamond, and nanoimprint tools approaching production-level throughputs....
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Leveraging Novel MEMS Technologies for Next-Generation Photovoltaic Applications
