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The latest news and information on semiconductor fab facilities, including manufacturing automation, e-manufacturing/e-diagnostics, chemicals/chemical management, gases/gas management, ultrapure water, vacuum systems, and waste treatment.

  • Funding for ISMI 450 mm Effort Doubling
    David Lammers, News Editor - 07/22/2008
     The large chip companies supporting the 450 mm wafer transition have put supplemental funding behind the 450 mm program at ISMI, said director Scott Kramer at SEMICON West. However, the large equipment vendors joined with SEMI officials to question the return on investment of the larger substrates. More

  • Hynix to Close Eugene Fab; Other 200 mm Fabs May Shut
    Staff - 07/24/2008
     Hynix Semiconductor Inc. announced it will close its 200 mm Eugene, Ore., fab, and is likely to shutter other 200 mm fabs in Asia. Hynix is considering its options for other 200 mm fabs, such as selling the equipment. More
  • CGMG Sees Slow Growth
    Alexander Braun, Senior Editor - 07/17/2008
     The Chemicals and Gases Manufacturers Group (CGMG) held its general meeting at SEMICON West, and several presenters considered leaders in their respective fields were invited to give their views on markets and technology. More
  • Breathing New Life Into Old Fabs
    Jonathan Davis, Executive Vice President, Global Expositions, Marketing, Communications and EHS, SEMI, San Jose - 07/15/2008
     There’s plenty of life left in, and profits to be made from, legacy fabs — facilities using older and refurbished equipment to produce non-leading-edge semiconductors, MEMS devices and photovoltaics (PV). More
  • Asyst Launches Agile Automation Aimed at Megafabs
    David Lammers, News Editor - 07/15/2008
     Asyst Technologies announced the Agile Automation solution at SEMICON West, aimed at easing wafer delivery bottlenecks for high-throughput tools in memory and logic megafabs. A key part of the Agile Automation system is the company’s direct-loading transport (DLT) lifting load port. Asyst claims the automation system reduces the time required to deliver a wafer to the tool. More
  • Reduced CapEx for Test
    Dan Tracy, Senior Director, and Lara Chamness, Senior Market Analyst, Industry Research and Statistics Group, SEMI, San Jose - 07/11/2008
     As a percentage of total spending on semiconductor capital equipment, spending on test equipment has trended below 20% of total equipment spending since the 2000 peak year of semiconductor industry equipment spending. More
  • Planes, Test and Capacity Management
    SEMI, San Jose - 07/11/2008
     Dan Hamling, founder and CEO of Chip Nexus (San Diego), will present on Thursday, July 17, at 11:00 a.m., as part of the SEMICON West Test, Assembly and Packaging TechXPOT. He emphasizes that improved profitability and ROI will be the result of appropriate use of test capacity management. More
  • ISMI to Report 450 mm Progress at West
    David Lammers, News Editor - 07/10/2008
     ISMI will present data gathered from 450 mm test wafers to several SEMI task forces at next week’s SEMICON West conference in San Francisco. ISMI Director Scott Kramer said, “This is our fundamental strategy: We are gathering data, doing testing, to influence the standards.” ISMI managers will also present progress on the 300 mm Next Generation Factory initiative. More
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Alexander E. Braun
The Measure of All Things
Alexander E. Braun, Senior Editor, Semiconductor International
July 14, 2008
Standalone Pushes Optical CD Boundaries
Semiconductor manufacturers face tough process and business challenges. On one hand t...
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David Lammers
Views on News
David Lammers, News Editor, Semiconductor International
May 28, 2008
Tom Ortman and a Re-Energized Austin
The energy crisis presents opportunities to the long chain of the IT industry, and eq...
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David Lammers
Views on News
David Lammers, News Editor, Semiconductor International
May 15, 2008
Y.W. Lee and Samsung's Rise
Yoon-Woo Lee, named Wednesday (May 14) to the CEO position at Samsung Electronics Co....
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Alexander E. Braun
The Measure of All Things
Alexander E. Braun, Senior Editor, Semiconductor International
May 9, 2008
Revisiting a Conference and Some Ongoing Problems
During a conversation on some of the lithography and metrology technology problems th...
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Vivek Bakshi, EUV Litho Inc.
Advocating More Open Communication on EUV Lithography

Vivek Bakshi, founder and president of EUV Litho Inc., explains why he started up the International Workshop on EUV Lithography, which took place in Maui in June. He also expands on recent developments in EUV, and why more research is needed.

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CMOS and Beyond: Surface Prep at Nanoscales
Now Playing: CMOS and Beyond: Surface Prep at Nanoscales
At SEMICON West 2006, Alex Braun interviews Ahmed Busnaina, director of the NSF Nanoscale Science and Engineering Center for High-Rate Nanomanufacturing at Northeastern University. Busnaina gives his perspective on the longevity of CMOS, nanotechnology, and surface preparation at nanoscales.
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Technical Articles

    Extending Fab Life: Measure, Monitor and Control
Dick Deininger and Rebecca Taylor, Taylor-Deininger Partners Inc., Austin, Texas, www.td-partners.com, 07/01/2008
 In legacy fabs, dynamic, remote monitoring of gauges can lead to significant improvements in productivity and cost savings....

    300mmPrime: Tackling Detractors of Fab Productivity
Denis Fandel and Robert Wright, International Sematech Manufacturing Initiative (ISMI), Austin, Texas, 07/01/2008
 Though the goals of 50% shorter manufacturing cycle time and 30% lower processed wafer cost were not shown to be achievable simultaneously, modeling and simulation demonstrated possible cycle time and cost savings based on shorter first wafer delay, higher equipment availability and conversions to single wafer processing....

    Detecting Hazardous Gases in the Fab
Patrick Hogan and Donald Galman, Honeywell Analytics, Lincolnshire, Ill., 07/01/2008
 Fab managers need proof of hazardous gas emissions, preferably in the form of fast response time, good selectivity, stability and visible proof of detection....

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Sept. 9-11, 2008
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