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The latest news and information on semiconductor manufacturing business and market research, including company revenue reports, mergers & acquisitions, industry forecasts, and market research reports.

  • Sakamoto Presents Innovations in Management
    Laura Peters, Editor-in-Chief - 07/16/2008
     It’s not every day that a CEO decides to cut his salary in half until the company returns to profitability, but that is exactly what Yukio Sakamoto, president, representative director and CEO of Elpida Memory (Tokyo), did recently in response to conditions in the DRAM market. More

  • Hynix to Close Eugene Fab; Other 200 mm Fabs May Shut
    Staff - 07/24/2008
     Hynix Semiconductor Inc. announced it will close its 200 mm Eugene, Ore., fab, and is likely to shutter other 200 mm fabs in Asia. Hynix is considering its options for other 200 mm fabs, such as selling the equipment. More
  • Funding for ISMI 450 mm Effort Doubling
    David Lammers, News Editor - 07/22/2008
     The large chip companies supporting the 450 mm wafer transition have put supplemental funding behind the 450 mm program at ISMI, said director Scott Kramer at SEMICON West. However, the large equipment vendors joined with SEMI officials to question the return on investment of the larger substrates. More
  • North American semi equipment industry in June reflects chipmakers' caution in spending
    By Ann Steffora Mutschler, Senior Editor - 07/18/2008
     As the industry awaits more clarity in the overall economic condition before increasing capital spending, manufacturers of semiconductor equipment in North America reported $1.03 billion in orders in June on a three-month average, and a book-to-bill ratio of 0.85 according to SEMI. More
  • Moore’s Law — A Holistic and Economic Approach
    Alexander Braun, Senior Editor - 07/16/2008
     Like a prophet descending from a holy mountain, Bernard Meyerson presented a new gospel of Moore’s Law in his keynote address, “Semiconductor Technology: A Convergence of Technology and Business Models,” given yesterday on the keynote stage in the West Hall. More
  • Changing Landscape Requires New Business Models
    Craig Addison, Senior Editor, Communications, SEMI, San Jose - 07/15/2008
     The semiconductor industry has reached a crucial turning point, and key players are reassessing the way they do business. Jim Clifford, senior vice president and general manager of Qualcomm CDMA Technologies (San Diego), discussed the need for the industry to adapt and how best to meet the needs of a changing market during a keynote address at the SEMICON West 2008 SEMI/Gartner Market Symposium yesterday. More
  • Equipment Sales Will Fall 20% in 2008
    Craig Addison, Senior Editor, Communications, SEMI, San Jose - 07/15/2008
     SEMI anticipates global semiconductor equipment sales of $34B this year, down 20% from $43B in 2007, according to the 2008 SEMI Mid-Year Equipment Forecast. More
  • Semiconductor equipment sales to fall 20% in 2008, SEMI reports
    By Ann Steffora Mutschler, Senior Editor - 07/14/2008
     Semicon West: Stanley T Myers, president of industry association Semiconductor Equipment and Materials International, predicts that 2008 semiconductor manufacturing equipment sales will fall approximately 20% this year to $34.12 billion. While this drop follows 6% market growth in 2007, SEMI believes the semiconductor manufacturing equipment industry will experience a rebound with annual growth of 13% in 2009, and 6% in 2010. More
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Laura Peters
SI's Take on Semicon West
Laura Peters, Editor-in-Chief, Semiconductor International
June 30, 2008
SEMICON West '08: SEMICON/West Morphs Into A Different Show
SEMICON/West has been evolving into a slightly different show every year. In many way...
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David Lammers
Views on News
David Lammers, News Editor, Semiconductor International
May 15, 2008
Y.W. Lee and Samsung's Rise
Yoon-Woo Lee, named Wednesday (May 14) to the CEO position at Samsung Electronics Co....
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Alexander E. Braun
The Measure of All Things
Alexander E. Braun, Senior Editor, Semiconductor International
May 13, 2008
A Modest Proposal
For decades now, there has been a desperate wringing of hands and loud, roaring noise...
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David Lammers
Views on News
David Lammers, News Editor, Semiconductor International
May 6, 2008
The Other 450 mm Shoe
The three companies openly pushing for 450 mm wafers are working on a plan to subsidi...
More

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Vivek Bakshi, EUV Litho Inc.
Advocating More Open Communication on EUV Lithography

Vivek Bakshi, founder and president of EUV Litho Inc., explains why he started up the International Workshop on EUV Lithography, which took place in Maui in June. He also expands on recent developments in EUV, and why more research is needed.

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CMOS and Beyond: Surface Prep at Nanoscales
Now Playing: CMOS and Beyond: Surface Prep at Nanoscales
At SEMICON West 2006, Alex Braun interviews Ahmed Busnaina, director of the NSF Nanoscale Science and Engineering Center for High-Rate Nanomanufacturing at Northeastern University. Busnaina gives his perspective on the longevity of CMOS, nanotechnology, and surface preparation at nanoscales.
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Technical Articles

    No Question of Solar Momentum in U.S.
Rhone Resch, President, Solar Energy Industries Association (SEIA), Washington, D.C., www.seia.org, 07/01/2008
 The U.S. solar energy industry, through a favorable mix of government incentives, corporate adoption and popularity with the public, has grown exponentially over the past few years. New solar installations nationwide increased by more than 40% from 2006 to 2007, resulting in 6000 new U.S. jobs....

    2008 Editors' Choice Best Product Awards
Jennifer Yario, Managing Editor, 07/01/2008
 Twenty products from 19 companies have been selected as recipients of the 2008 Editors' Choice Best Product Awards, annually awarded by Semiconductor International....

    SEMICON West 2008 Executive Outlook
Staff, 06/15/2008
 In the front end, all eyes are on the extension of 193 nm lithography with immersion and double patterning, along with making high-k/metal gate processes more cost-effective. Meanwhile, real 3-D integration is occurring with package-on-package (PoP) and 3-D ICs using through-silicon vias (TSVs). Executives throughout the industry are emphasizing the importance of energy conservation, cost-effectiveness and high productivity — key measures going forward....

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